A study on the interfacial composition of the electroless-copper-plated BPDA-PDA polyimide sheet
Abstract
This work studies the chemical composition at the interface generated through the electroless deposition of a copper layer onto a polyimide (PI) slice. Upilex-S®-50 [poly(biphenyl dianhydride-p-phenylenediamine)]
(BPDA-PDA) polyimide film was selected as the substrate, on which wet chemstry modifications were carried out before plating. The modifications comprise the alkali catalyzed