Abstract

A new curing system used for prolonging the shelf-life of epoxy resin-based microelectronic packaging material (E-MPM) was first prepared by an in situ tubing/entrapping method. Based on supramolecular interactions a curing accelerator (C) for epoxy resin, boron trifluoride–pyridine (BF₃·Py), has been trapped into the pores of polyorganosiloxane (POS) containing a nanoscale tubular structure, which is prepared by hydrosilylation of two reactive, cis-isotactic ladderlike polyallylsilsesquioxane (Allyl-T) molecules with two reactive, α,ω-coupling agents (1,1,3,3-tetramethyldisiloxane, H-MM) in two plus two (2 + 2) mode using Cp₂PtCl₂ as catalyst. Various characterizations including optical polarized microscopy (OPM) observations, differential scanning calorimetry (DSC) measurements, storage and curing tests and molecular mechanical simulation are combined to confirm that the accelerator BF₃·Py is simultaneously trapped during the formation of POS and moreover, to indicate that entrapment of the accelerator C with POS is a promising alternative way to prolong the shelf-life of the E-MPM at ambient temperature.