Issue 4, 2002

Abstract

Theoretical calculations of the thermal expansion coefficients of the solder alloy systems Sn–Pb and Sn–Ag were attempted by using a cluster expansion method. Five ordered fcc phases for each system were employed to perform the matrix inversion and to determine the correlation coefficients in cluster expansion formalism. The coefficients of thermal expansion of the ordered alloys were obtained through first-principles electronic structure calculations coupled with a Debye treatment of the vibrating lattice. The correlation functions for disordered alloys were derived through Monte-Carlo simulations. The calculated results are in very good agreement with experiments, indicating the feasibility of using cluster expansion theory for thermal expansion coefficient calculations. This study may provide a simple approach to estimating thermal expansion coefficients of disordered structures.

Graphical abstract: Coefficient of thermal expansion for solder alloys based on cluster expansion method

Article information

Article type
Paper
Submitted
11 Jul 2001
Accepted
04 Jan 2002
First published
04 Mar 2002

J. Mater. Chem., 2002,12, 1090-1093

Coefficient of thermal expansion for solder alloys based on cluster expansion method

H. Mei Jin and P. Wu, J. Mater. Chem., 2002, 12, 1090 DOI: 10.1039/B106139A

To request permission to reproduce material from this article, please go to the Copyright Clearance Center request page.

If you are an author contributing to an RSC publication, you do not need to request permission provided correct acknowledgement is given.

If you are the author of this article, you do not need to request permission to reproduce figures and diagrams provided correct acknowledgement is given. If you want to reproduce the whole article in a third-party publication (excluding your thesis/dissertation for which permission is not required) please go to the Copyright Clearance Center request page.

Read more about how to correctly acknowledge RSC content.

Spotlight

Advertisements