Issue 10, 2002

O2 plasma treated polyimide-based humidity sensors

Abstract

The effect of non-plasma and plasma treated polyimide-based humidity sensors is presented. Pure oxygen was used to etch polyimide in a plasma etcher. The sensor treated in a plasma exhibited higher sensitivity and faster response speed against moisture. The plasma treated sensor had 3.4 times the sensitivity and responded almost twice as fast as the non-plasma treated sensor. A further comparison of sensor outputs, sensitivity and response speed are presented. Chemical analysis of the polyimide surface was carried out by X-ray photoelectron spectroscopy (XPS) and Fourier transform infrared spectroscopy (ATR-FTIR). XPS and ATR-FTIR showed the increase in carbonyl carbon bonds, C[double bond, length half m-dash]O, after the plasma treatment. Geometrical modification was observed by atomic force microscopy (AFM). It showed considerable surface roughness after the plasma treatment. O2 plasma treatment improved the sensitivity, and reduced the hysteresis of the sensor due to the increase in C[double bond, length half m-dash]O bonds in the polyimide.

Article information

Article type
Paper
Submitted
27 May 2002
Accepted
17 Jul 2002
First published
27 Aug 2002

Analyst, 2002,127, 1342-1346

O2 plasma treated polyimide-based humidity sensors

T. Suzuki, P. Tanner and D. V. Thiel, Analyst, 2002, 127, 1342 DOI: 10.1039/B205085D

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