Issue 17, 2024

Design, synthesis, and applications of plasmonic semiconductor WO3−x photocatalyst

Abstract

Localized surface plasmon resonance (LSPR) facilitates solar-to-chemical conversion, which is a rapidly expanding field that effectively harnesses solar energy because of its distinct catalytic and optical responses. Plasmonic WO3−x exhibits great potential to absorb NIR light of the solar spectrum owing to LSPR. WO3−x also exhibits tremendous potential in the field of photocatalysis because of its exceptional features, which include low toxicity, low cost, excellent carrier mobility, stability, and ease of synthesis. In this report, we have discussed the different synthesis techniques for WO3−x photocatalysts, the tunability to enhance light absorption and the accelerating transfer of charge carriers. This review further emphasizes recent developments in the applications of plasmonic semiconductor WO3−x nanostructures in hydrogen generation from water splitting and ammonia borane (AB) dehydrogenation, CO2 reduction, organic transformations, and pollutant degradation under visible-NIR light illumination. The fundamental mechanisms for increased catalytic activities, as well as the rational design of hybrid WO3−x nanocatalysts, have been discussed. The present obstacles and potential future directions have also been explored to advance plasmon-mediated heterogeneous catalysis toward practical applications. This article aims to provide a thorough understanding of synthesis, modification, and recent developments in the application of NIR light-driven catalysis of WO3−x materials.

Graphical abstract: Design, synthesis, and applications of plasmonic semiconductor WO3−x photocatalyst

Article information

Article type
Review Article
Submitted
20 May 2024
Accepted
21 Jul 2024
First published
22 Jul 2024

Catal. Sci. Technol., 2024,14, 4775-4798

Design, synthesis, and applications of plasmonic semiconductor WO3−x photocatalyst

Dimple, Priyanka, R. Watanabe, C. Fukuhara, H. Yamashita and P. Verma, Catal. Sci. Technol., 2024, 14, 4775 DOI: 10.1039/D4CY00645C

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