Issue 36, 2022

An efficient cooling solution with 3D interconnected graphene architectures for passive heat dissipation

Abstract

Efficient passive cooling for miniaturized and integrated electronic devices could enhance device reliability with reduced energy consumption. The realization of this technology calls for highly efficient passive heat dissipation materials. In this work, we report a water-based acrylic resin (AR) mediated one-step electrochemical preparation of hybridized reduced graphene oxide membranes. Their well-defined porous structures are demonstrated to enhance the passive heat dissipation of traditional metal-based heat sinks. The 3D reduced graphene oxide membrane with 5% AR combines the efficient thermal radiation from graphene sheets and the AR-mediated cross-planar heat transfer. Outstanding heat dissipation performance was demonstrated by a cooling efficiency of 22% and a significant 31 °C reduction in working temperature for a high-power commercial LED. This work corroborates the potential of 3D hybridized reduced graphene oxide as a light, flexible, and effective cooling material for future thermal management applications.

Graphical abstract: An efficient cooling solution with 3D interconnected graphene architectures for passive heat dissipation

Supplementary files

Article information

Article type
Paper
Submitted
13 Apr 2022
Accepted
13 Aug 2022
First published
15 Aug 2022

J. Mater. Chem. C, 2022,10, 13167-13173

An efficient cooling solution with 3D interconnected graphene architectures for passive heat dissipation

Y. Weng, S. Wu, L. Wang, W. Zhao, Y. Jiang and Y. Deng, J. Mater. Chem. C, 2022, 10, 13167 DOI: 10.1039/D2TC01524B

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