Issue 34, 2018, Issue in Progress

Polyimide film with low thermal expansion and high transparency by self-enhancement of polyimide/SiC nanofibers net

Abstract

A facile approach to synthesize a polyimide (PI) film with enhanced dimensional stability, a high mechanical property and optical transparency is presented by embedding the partial imidized PI/SiC nanofiber-net in a poly(amic acid) (PAA) solution, followed by removing the solvent and imidization of the PAA. The nanofiber-network self-filled PI film demonstrates a much lower thermal expansion coefficient (CTE), an excellent mechanical property and high transparency retention in comparison to the film fabricated by solution cast. When the SiC content is 6 wt% in PI/SiC nanofibers, the CTE values for the PI film containing 25 wt% PI/SiC nanofibers are 2.80 times lower than the solution cast PI/SiC film. The tensile strength and modulus for the PI/SiC fiber filled film are also improved by 159% and 91% respectively in comparison to the solution cast SiC/PI film. In addition, the PI/SiC nanofiber-network filled PI film exhibits a high optic transparency. The significant improvement in aforementioned properties is contributed to by the long and continuous nanonetwork which acts as a frame to maintain the stable dimension and endow the film with high mechanical properties. Moreover, the nanosized SiC particles were constricted within the nano-fiber to avoid light scattering, so the high transparency of the film was retained.

Graphical abstract: Polyimide film with low thermal expansion and high transparency by self-enhancement of polyimide/SiC nanofibers net

Supplementary files

Article information

Article type
Paper
Submitted
22 Mar 2018
Accepted
02 May 2018
First published
23 May 2018
This article is Open Access
Creative Commons BY-NC license

RSC Adv., 2018,8, 19034-19040

Polyimide film with low thermal expansion and high transparency by self-enhancement of polyimide/SiC nanofibers net

F. Liu, Z. Liu, S. Gao, Q. You, L. Zou, J. Chen, J. Liu and X. Liu, RSC Adv., 2018, 8, 19034 DOI: 10.1039/C8RA02479K

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