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Issue 23, 2018
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Surface premelting/recrystallization governing the collapse of open-cell nanoporous Cu via thermal annealing

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Abstract

We systematically investigate the collapse of a set of open-cell nanoporous Cu (np-Cu) materials with the same porosity and shape but different specific surface areas, during thermal annealing, by performing large-scale molecular dynamics simulations. Two mechanisms govern the collapse of np-Cu. One is direct surface premelting, facilitating the collapse of np-Cu, when the specific surface area is less than a critical value (∼2.38 nm−1). The other is recrystallization followed by surface premelting, accelerating the sloughing of ligaments and the annihilation of voids, when the critical specific surface area is exceeded. Surface premelting results from surface reconstruction by prompting localized “disordering” and “chaos” on the surface, and the melting temperature reduces linearly with the increase of the specific surface area. Recrystallization is followed by surface premelting as the melting temperature is below the supercooling point, where a liquid is unstable and instantaneously recrystallizes.

Graphical abstract: Surface premelting/recrystallization governing the collapse of open-cell nanoporous Cu via thermal annealing

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Publication details

The article was received on 11 Apr 2018, accepted on 21 May 2018 and first published on 21 May 2018


Article type: Paper
DOI: 10.1039/C8CP02287A
Citation: Phys. Chem. Chem. Phys., 2018,20, 16184-16192
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    Surface premelting/recrystallization governing the collapse of open-cell nanoporous Cu via thermal annealing

    L. Wang, X. M. Zhang, L. Deng, J. F. Tang, S. F. Xiao, H. Q. Deng and W. Y. Hu, Phys. Chem. Chem. Phys., 2018, 20, 16184
    DOI: 10.1039/C8CP02287A

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