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Issue 38, 2017, Issue in Progress
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Oxidation-resistant micron-sized Cu–Sn solid particles fabricated by a one-step and scalable method

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Abstract

Micron-sized solid Cu–Sn particles have been considered as a replacement for more expensive materials (e.g., Ag, Pd, and Au) in conductive pastes used in printed electronics, solar cell metallization, and interference packaging. With the formation of a tin oxide layer, Cu–Sn particles could combine relatively low electrical resistivity with high oxidation resistance. However the oxidation behavior of this system is not well understood. Here, the oxidation of CuSny solid particles, fabricated by spray pyrolysis without direct addition of H2, was investigated. Our experimental results and theoretical analysis suggest that at a low oxidation temperature (300 °C), the migration of O2− through the oxide layer controls the oxidation. At high temperature (500 °C), the grain growth of the oxide layer is believed to be the rate-limiting step. Among the CuSny particles tested, CuSn0.1 powders exhibited the best particle structure (solid and spherical) and highest oxidation resistance.

Graphical abstract: Oxidation-resistant micron-sized Cu–Sn solid particles fabricated by a one-step and scalable method

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Publication details

The article was received on 19 Feb 2017, accepted on 13 Apr 2017 and first published on 27 Apr 2017


Article type: Paper
DOI: 10.1039/C7RA02080E
Citation: RSC Adv., 2017,7, 23468-23477
  • Open access: Creative Commons BY-NC license
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    Oxidation-resistant micron-sized Cu–Sn solid particles fabricated by a one-step and scalable method

    Y. Liang, S. C. Oh, X. Wang, H. Glicksman, D. Liu and S. Ehrman, RSC Adv., 2017, 7, 23468
    DOI: 10.1039/C7RA02080E

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