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Issue 35, 2017
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Underpotential deposition of Cu on Au(111) from neutral chloride containing electrolyte

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Abstract

The structure of a chloride terminated copper monolayer electrodeposited onto Au(111) from a CuSO4/KCl electrolyte was investigated ex situ by three complementary experimental techniques (scanning tunneling microscopy (STM), photoelectron spectroscopy (PES), X-ray standing wave (XSW) excitation) and density functional theory (DFT) calculations. STM at atomic resolution reveals a stable, highly ordered layer which exhibits a Moiré structure and is described by a (5 × 5) unit cell. The XSW/PES data yield a well-defined position of the Cu layer and the value of 2.16 Å above the topmost Au layer suggests that the atoms are adsorbed in threefold hollow sites. The chloride exhibits some distribution around a distance of 3.77 Å in agreement with the observed Moiré pattern due to a higher order commensurate lattice. This structure, a high order commensurate Cl overlayer on top of a commensurate (1 × 1) Cu layer with Cu at threefold hollow sites, is corroborated by the DFT calculations.

Graphical abstract: Underpotential deposition of Cu on Au(111) from neutral chloride containing electrolyte

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Publication details

The article was received on 23 Jun 2017, accepted on 15 Aug 2017 and first published on 15 Aug 2017


Article type: Paper
DOI: 10.1039/C7CP04244B
Citation: Phys. Chem. Chem. Phys., 2017,19, 24146-24153
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    Underpotential deposition of Cu on Au(111) from neutral chloride containing electrolyte

    H. Aitchison, N. Meyerbröker, T. Lee, J. Zegenhagen, T. Potter, H. Früchtl, I. Cebula and M. Buck, Phys. Chem. Chem. Phys., 2017, 19, 24146
    DOI: 10.1039/C7CP04244B

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