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Issue 60, 2015
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Adhesion promoter for a multi-dielectric-layer on a digital microfluidic chip

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Abstract

A silane-based adhesion promoter suitable for a multi-dielectric-layer coating on a digital microfluidic chip is reported. It measures >100× improvement in chip lifetime via transforming the bonding of the dielectric layers (Ta2O5 and Parylene C) from nonspecific to chemical. The refined chip-fabrication protocol also allows low EWOD actuation voltages down to 5 V.

Graphical abstract: Adhesion promoter for a multi-dielectric-layer on a digital microfluidic chip

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Publication details

The article was received on 04 May 2015, accepted on 26 May 2015 and first published on 26 May 2015


Article type: Communication
DOI: 10.1039/C5RA08202A
Citation: RSC Adv., 2015,5, 48626-48630
  • Open access: Creative Commons BY-NC license
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    Adhesion promoter for a multi-dielectric-layer on a digital microfluidic chip

    J. Gao, T. Chen, C. Dong, Y. Jia, P. Mak, Mang-I. Vai and R. P. Martins, RSC Adv., 2015, 5, 48626
    DOI: 10.1039/C5RA08202A

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