Issue 8, 2015

Development of halogen-free flame retardant phosphazene and rice husk ash incorporated benzoxazine blended epoxy composites for microelectronic applications

Abstract

The present study is focused on the synthesis and characterization of flame retardant amine-terminated cyclophosphazene and silane functionalized rice husk ash reinforced benzoxazine blended epoxy composites as a halogen-free flame retardant material (ATCP/FRHA/Bz-Ep). FT-IR spectroscopy, scanning electron microscopy (SEM), X-ray diffraction analysis, contact angle measurements, dielectric constant, DSC, TGA, UL-94, LOI and cone calorimetry were used to characterize the surface morphology as well as the structural, electrical, thermal and flame retardant properties of the resultant ATCP/FRHA/Bz-Ep composite material. The experimental results suggested that ATCP/FRHA/Bz-Ep composites exhibit better flame retardant and dielectric performance compared to that of a neat Bz–Ep material. A plausible mechanism of the fire retardant ATCP/FRHA/Bz-Ep composite material is hypothesized based on the results of cone calorimetric, thermal and electrical analysis. From the abovementioned results, it was concluded that the ATCP/FRHA/Bz-Ep composite can be used as an electrical resistant material for electronic and microelectronic applications.

Graphical abstract: Development of halogen-free flame retardant phosphazene and rice husk ash incorporated benzoxazine blended epoxy composites for microelectronic applications

Article information

Article type
Paper
Submitted
10 Feb 2015
Accepted
17 Jun 2015
First published
19 Jun 2015

New J. Chem., 2015,39, 6555-6567

Author version available

Development of halogen-free flame retardant phosphazene and rice husk ash incorporated benzoxazine blended epoxy composites for microelectronic applications

K. Krishnadevi and V. Selvaraj, New J. Chem., 2015, 39, 6555 DOI: 10.1039/C5NJ00364D

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