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Issue 12, 2015
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High depth-resolution laser ablation chemical analysis of additive-assisted Cu electroplating for microchip architectures

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Abstract

Laser ablation/ionisation mass spectrometry with a vertical resolution at a nanometre scale was applied for the quantitative characterisation of the chemical composition of additive-assisted Cu electroplated deposits used in the microchip industry. The detailed chemical analysis complements information gathered by optical techniques and allows new insights into the metal deposition process.

Graphical abstract: High depth-resolution laser ablation chemical analysis of additive-assisted Cu electroplating for microchip architectures

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Publication details

The article was received on 21 Jul 2015, accepted on 14 Oct 2015 and first published on 27 Oct 2015


Article type: Communication
DOI: 10.1039/C5JA00295H
Citation: J. Anal. At. Spectrom., 2015,30, 2371-2374
  • Open access: Creative Commons BY license
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    High depth-resolution laser ablation chemical analysis of additive-assisted Cu electroplating for microchip architectures

    A. Riedo, V. Grimaudo, P. Moreno-García, M. B. Neuland, M. Tulej, P. Wurz and P. Broekmann, J. Anal. At. Spectrom., 2015, 30, 2371
    DOI: 10.1039/C5JA00295H

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