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Issue 29, 2014
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Reversible metallisation of soft UV patterned substrates

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Abstract

Soft UV (365 nm) patterning of ortho-nitrobenzyl functionalized thiol-on-gold self-assembled monolayers (SAMs) using acid catalysis, produces surfaces which can be used for the selective electro-deposition of copper. Exploiting the difference in the reduction peak potential between the photolysed and the masked regions of the SAM allows copper to be deposited selectively on those areas that have been exposed to the light. The copper can be removed by raising the electrode potential. The process is fully reversible so that depositing a pattern of copper, and removing it again is something that can be repeated many times. The copper deposited on the photolysed regions, like copper deposited on bare gold, forms a film of copper oxide, and so it is presumably formed on top of the SAM. Preliminary results for two-photon photocleavage show that it is also possible to implement patterning with sub-wavelength features.

Graphical abstract: Reversible metallisation of soft UV patterned substrates

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Publication details

The article was received on 08 Mar 2014, accepted on 02 May 2014 and first published on 06 May 2014


Article type: Paper
DOI: 10.1039/C4TC00464G
Author version available: Download Author version (PDF)
Citation: J. Mater. Chem. C, 2014,2, 5916-5923
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    Reversible metallisation of soft UV patterned substrates

    P. Prompinit, A. S. Achalkumar, A. S. Walton, R. J. Bushby, C. Wälti and S. D. Evans, J. Mater. Chem. C, 2014, 2, 5916
    DOI: 10.1039/C4TC00464G

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