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Issue 8, 2014
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Enhancement of seawater corrosion resistance in copper using acetone-derived graphene coating

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Abstract

We show that acetone-derived graphene coating can effectively enhance the corrosion efficiency of copper (Cu) in a seawater environment (0.5–0.6 M (∼3.0–3.5%) sodium chloride). By applying a drop of acetone (∼20 μl cm−2) on Cu surfaces, rapid thermal annealing allows the facile and rapid synthesis of graphene films on Cu surfaces with a monolayer coverage of almost close to ∼100%. Under optimal growth conditions, acetone-derived graphene is found to have a relatively high crystallinity, comparable to common graphene grown by chemical vapor deposition. The resulting graphene-coated Cu surface exhibits 37.5 times higher corrosion resistance as compared to that of mechanically polished Cu. Further, investigation on the role of graphene coating on Cu surfaces suggests that the outstanding corrosion inhibition efficiency (IE) of 97.4% is obtained by protecting the underlying Cu against the penetration of both dissolved oxygen and chlorine ions, thanks to the closely spaced atomic structure of the graphene sheets. The increase of graphene coating thickness results in the enhancement of the overall corrosion IE up to ∼99%, which can be attributed to the effective blocking of the ionic diffusion process via grain boundaries. Overall, our results suggest that the acetone-derived graphene film can effectively serve as a corrosion-inhibiting coating in the seawater level and that it may have a promising role to play for potential offshore coating.

Graphical abstract: Enhancement of seawater corrosion resistance in copper using acetone-derived graphene coating

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Publication details

The article was received on 11 Nov 2013, accepted on 31 Jan 2014 and first published on 31 Jan 2014


Article type: Paper
DOI: 10.1039/C3NR05997A
Citation: Nanoscale, 2014,6, 4379-4386
  • Open access: Creative Commons BY license
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    Enhancement of seawater corrosion resistance in copper using acetone-derived graphene coating

    J. Huh, S. H. Kim, J. H. Chu, S. Y. Kim, J. H. Kim and S. Kwon, Nanoscale, 2014, 6, 4379
    DOI: 10.1039/C3NR05997A

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