Superstrong encapsulated monolayer graphene by the modified anodic bonding

Abstract

We report a superstrong adhesive of monolayer graphene by modified anodic bonding. In this bonding, graphene plays the role of a superstrong and ultra-thin adhesive between SiO₂ and glass substrates. As a result, monolayer graphene presented a strong adhesion energy of 1.4 J m⁻² about 310% that of van der Waals bonding (0.45 J m⁻²) to SiO₂ and glass substrates. This flexible solid state graphene adhesive can tremendously decrease the adhesive thickness from about several tens of μm to 0.34 nm for epoxy or glue at the desired bonding area. As plausible causes of this superstrong adhesion, we suggest conformal contact with the rough surface of substrates and generation of C–O chemical bonding between graphene and the substrate due to the bonding process, and characterized these properties using optical microscopy, atomic force microscopy, Raman spectroscopy, and X-ray photoelectron spectroscopy.