Issue 4, 2015

Electrodeposition and characterization of copper nanocone structures

Abstract

In this work, large-scale Cu nanocone arrays were synthesized by a one-step electrodeposition method without any template. The surface morphologies of Cu deposits prepared under different fabrication conditions have been observed. The as-prepared Cu nanocones grow preferentially along the <111> direction. The formation mechanism of the nanocone structure can be explained by the screw dislocation driven growth theory. In addition, this electrodeposited Cu film with nanocone structure exhibits a superhydrophobic property after chemical modification.

Graphical abstract: Electrodeposition and characterization of copper nanocone structures

Article information

Article type
Paper
Submitted
30 Sep 2014
Accepted
25 Nov 2014
First published
25 Nov 2014

CrystEngComm, 2015,17, 868-876

Electrodeposition and characterization of copper nanocone structures

Y. Deng, H. Ling, X. Feng, T. Hang and M. Li, CrystEngComm, 2015, 17, 868 DOI: 10.1039/C4CE01993H

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