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Issue 16, 2014
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Unravelling transient phases during thermal oxidation of copper for dense CuO nanowire growth

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Abstract

Direct evidence of cupric ion outdiffusion through grain boundaries during thermal oxidation of high purity Cu is obtained using Raman spectroscopy. This diffusion feeds the growth of CuO nanowires on the surface while forming a Cu1+xO phase in the grain boundaries of the underlying Cu2O film. On complete Cu consumption, counter indiffusion of O2− ions converts the entire structure to a CuO film, while viable CuO nanowires still remain on the surface.

Graphical abstract: Unravelling transient phases during thermal oxidation of copper for dense CuO nanowire growth

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Publication details

The article was received on 05 Feb 2014, accepted on 26 Feb 2014 and first published on 26 Feb 2014


Article type: Communication
DOI: 10.1039/C4CE00275J
Citation: CrystEngComm, 2014,16, 3264-3267
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    Unravelling transient phases during thermal oxidation of copper for dense CuO nanowire growth

    F. Wu, Y. Myung and P. Banerjee, CrystEngComm, 2014, 16, 3264
    DOI: 10.1039/C4CE00275J

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