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Issue 28, 2013
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The conduction development mechanism of silicone-based electrically conductive adhesives

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Abstract

The conduction development mechanism of silicone-based electrically conductive adhesives (Silo-ECAs) is studied. The reduction of surfactants on silver flakes by hydride in the silicone backbone and the subsequent sintering of the generated silver nanoparticles between micron-sized silver flakes are found to be the major contributor to the conductivity development in Silo-ECAs; this is in contrast with the mechanism observed in most polymer–metal ECAs, where the curing shrinkage of the polymer matrix is the major cause of conductivity development. The conductivity development in Silo-ECAs ceases when the polymer curing is completed. Hence, in order to enhance the resulting electrical conductivity, the curing process is prolonged by using a long-chain prepolymer, lowering the platinum catalyst concentration, or adding curing inhibitors. A bulk resistivity of 8.82 × 10−5 Ω cm is achieved, which is 55% lower than the best values reported previously for Silo-ECAs.

Graphical abstract: The conduction development mechanism of silicone-based electrically conductive adhesives

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Publication details

The article was received on 03 Apr 2013, accepted on 10 May 2013 and first published on 13 May 2013


Article type: Paper
DOI: 10.1039/C3TC30612G
Citation: J. Mater. Chem. C, 2013,1, 4368-4374
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    The conduction development mechanism of silicone-based electrically conductive adhesives

    Z. Li, K. Hansen, Y. Yao, Y. Ma, K. Moon and C. P. Wong, J. Mater. Chem. C, 2013, 1, 4368
    DOI: 10.1039/C3TC30612G

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