Issue 18, 2013

Generation of scalable quasi-3D metallo-dielectric SERS substrates through orthogonal reactive ion etching

Abstract

We combined two orthogonal reactive ion etching strategies on monolayers of 4 μm diameter polystyrene (PS) microspheres assembled on a planar glass substrate to create geometrically diverse but highly regular quasi-3D nano-structured arrays with centimeter length scales. Reactive ion etching (RIE) with O2/CF4 was used to selectively etch PS and, thus, to adjust the morphology of the PS mask, and CHF3 RIE was then used to etch the SiO2 substrate. The dynamic combination of these two etching procedures facilitated the realization of a wide variety of 3D-corrugated surface morphologies, including pedestals, bowls, honeycombs and blossom bud like arrays. The generated structures were then evaporated with Au films of defined thicknesses to generate metallo-dielectric arrays with tunable surface roughness. Hexagonal diffraction patterns from the fabricated structures confirm the successful realization of extended periodic hexagonal structures and the optical transmission spectra showed an efficient trapping of incident light in these ultra-rough metallo-dielectric arrays. The metallo-dielectric substrates were finally optimized for the detection of the pesticide methyl parathion in a concentration as low as 1 × 10−10 M through surface enhanced Raman spectroscopy (SERS).

Graphical abstract: Generation of scalable quasi-3D metallo-dielectric SERS substrates through orthogonal reactive ion etching

Supplementary files

Article information

Article type
Paper
Submitted
17 Jan 2013
Accepted
21 Mar 2013
First published
25 Mar 2013

J. Mater. Chem. C, 2013,1, 3110-3118

Generation of scalable quasi-3D metallo-dielectric SERS substrates through orthogonal reactive ion etching

W. Ahn, Y. Qiu and B. M. Reinhard, J. Mater. Chem. C, 2013, 1, 3110 DOI: 10.1039/C3TC30110A

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