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Issue 57, 2013
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A novel planarization method based on photoinduced confined chemical etching

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Abstract

A photoinduced confined chemical etching system based on TiO2 nanotube arrays is developed for the planarization of the copper surface, which is proved to be a prospective stress-free chemical planarization method for metals and semiconductors.

Graphical abstract: A novel planarization method based on photoinduced confined chemical etching

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Publication details

The article was received on 01 Apr 2013, accepted on 24 May 2013 and first published on 28 May 2013


Article type: Communication
DOI: 10.1039/C3CC42368A
Citation: Chem. Commun., 2013,49, 6451-6453
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    A novel planarization method based on photoinduced confined chemical etching

    Q. Fang, J. Zhou, D. Zhan, K. Shi, Z. Tian and Z. Tian, Chem. Commun., 2013, 49, 6451
    DOI: 10.1039/C3CC42368A

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