Issue 57, 2013
From the journal:

Chemical Communications

A novel planarization method based on photoinduced confined chemical etching†

Qiuyan Fang,a   Jian-Zhang Zhou,*a   Dongping Zhan,a   Kang Shi,a   Zhao-Wu Tiana  and  Zhong-Qun Tiana  

* Corresponding authors

a State Key Laboratory of Physical Chemistry of Solid Surfaces and Department of Chemistry, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen 361005, China
E-mail: jzzhou@xmu.edu.cn
Fax: +86 592 2183407
Tel: +86 592 2189663

Abstract

A photoinduced confined chemical etching system based on TiO2 nanotube arrays is developed for the planarization of the copper surface, which is proved to be a prospective stress-free chemical planarization method for metals and semiconductors.

Graphical abstract: A novel planarization method based on photoinduced confined chemical etching

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Article information

DOI
https://doi.org/10.1039/C3CC42368A
Article type
Communication
Submitted
01 Apr 2013
Accepted
24 May 2013
First published
28 May 2013

Chem. Commun., 2013,49, 6451-6453

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A novel planarization method based on photoinduced confined chemical etching

Q. Fang, J. Zhou, D. Zhan, K. Shi, Z. Tian and Z. Tian, Chem. Commun., 2013, 49, 6451 DOI: 10.1039/C3CC42368A

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