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Thermo-compressive transfer printing for facile alignment and robust device integration of nanowires

Won Seok Lee,a   Sejeong Won,a   Jeunghee Park,c   Jihye Lee*b and   Inkyu Park*a  
Corresponding authors
Department of Mechanical Engineering and KI for the NanoCentury, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 305-701, Korea
E-mail: inkyu
Fax: +82-42-350-3210
Tel: +82-42-350-3233
Department of Nano Manufacturing Technology, Korea Institute of Machinery and Materials (KIMM), Daejeon 305-343, Korea
E-mail: jihyelee
Fax: +82-42-868-7123
Tel: +82-42-868-7801
Department of Chemistry, Korea University, Jochiwon 339-700, Korea
Nanoscale, 2012,4, 3444-3449

DOI: 10.1039/C2NR30392B
Received 18 Feb 2012, Accepted 21 Mar 2012
First published online 27 Mar 2012
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