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Paper

Low cost integration of 3D-electrode structures into microfluidic devices by replica molding

Benjamin Mustin*a and   Boris Stoeberb  
*
Corresponding authors
a
The University of British Columbia, 2054-6250 Applied Science Lane, Vancouver, Canada
E-mail: mustin@mech.ubc.ca
Fax: +1 604 822-2403
Tel: +1 604 827-4593
b
The University of British Columbia, 2054-6250 Applied Science Lane, Vancouver, Canada
E-mail: boris.stoeber@ubc.ca
Fax: +1 604 822-2403
Tel: +1 604 827-5907
Lab Chip, 2012,12, 4702-4708

DOI: 10.1039/C2LC40728K
Received 28 Jun 2012, Accepted 29 Aug 2012
First published online 31 Aug 2012
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