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Issue 18, 2011
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Mechanics of reversible adhesion

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Abstract

By pressure-controlled surface contact area, reversible adhesion can be achieved with strengths tunable by 3 orders of magnitude. This capability facilitates robust transfer printing of active materials and devices onto any surface for the development of stretchable and/or curvilinear electronics. The most important parameter in designing the surfaces of stamps for this process is the height of the microtips relief: tall microtips may fail to pick up electronics from their growth substrate, while short ones may fail to print electronics on the receiver substrate. Mechanics models are developed to determine the range of the microtip height for successful transfer printing. Analytical expressions for the minimum and maximum heights are obtained, which are very useful for stamp design.

Graphical abstract: Mechanics of reversible adhesion

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Publication details

The article was received on 17 May 2011, accepted on 05 Jul 2011 and first published on 08 Aug 2011


Article type: Paper
DOI: 10.1039/C1SM05915G
Citation: Soft Matter, 2011,7, 8657-8662
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    Mechanics of reversible adhesion

    J. Wu, S. Kim, W. Chen, A. Carlson, K. Hwang, Y. Huang and J. A. Rogers, Soft Matter, 2011, 7, 8657
    DOI: 10.1039/C1SM05915G

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