Investment into photovoltaic (PV) research has accelerated over the past decade as concerns over energy security and carbon emissions have increased. The types of PV technology in which the research community is actively engaged are expanding as well. This review focuses on the burgeoning field of atomic layer deposition (ALD) for photovoltaics. ALD is a self-limiting thin film deposition technique that has demonstrated usefulness in virtually every sector of PV technology including silicon, thin film, tandem, organic, dye-sensitized, and next generation solar cells. Further, the specific applications are not limited. ALD films have been deposited on planar and nanostructured substrates and on inorganic and organic devices, and vary in thickness from a couple of angstroms to over 100 nm. The uses encompass absorber materials, buffer layers, passivating films, anti-recombination shells, and electrode modifiers. Within the last few years, the interest in ALD as a PV manufacturing technique has increased and the functions of ALD have expanded. ALD applications have yielded fundamental understanding of how devices operate and have led to increased efficiencies or to unique architectures for some technologies. This review also highlights new developments in high throughput ALD, which is necessary for commercialization. As the demands placed on materials for the next generation of PV become increasingly stringent, ALD will evolve into an even more important method for research and fabrication of solar cell devices.