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BIOS, The Lab-on-a-Chip Group, MESA+ Institute for Nanotechnology, University of Twente, Postbus 217, Enschede, The Netherlands
; Fax: +31 534893595
; Tel: +31 534892691
Lab Chip, 2010,10, 2115-2121
17 Mar 2010,
14 May 2010
First published online
17 Jun 2010
In the fields of MicroElectroMechanical Systems (MEMS) and Lab On a Chip (LOC), a device is often fabricated using diverse substrates which are processed separately and finally assembled together using a bonding process to yield the final device. Here we describe and demonstrate a novel straightforward, rapid and low-temperature bonding technique for the assembly of complete microfluidic devices, at the chip level, by employing an intermediate layer of gluing material. This technique is applicable to a great variety of materials (e.g., glass, SU-8, parylene, UV-curable adhesive) as demonstrated here when using NOA 81 as gluing material. Bonding is firstly characterized in terms of homogeneity and thickness of the gluing layer. Following this, we verified the resistance of the adhesive layer to various organic solvents, acids, bases and conventional buffers. Finally, the assembled devices are successfully utilized for fluidic experiments.
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