Jump to main content
Jump to site search

Issue 39, 2010
Previous Article Next Article

Printed electronics: the challenges involved in printing devices, interconnects, and contacts based on inorganic materials

Author affiliations

Abstract

Printed electronics represent an emerging area of research that promises large markets due to the ability to bypass traditional expensive and inflexible silicon-based electronics to fabricate a variety of devices on flexible substrates using high-throughput printing approaches. This article presents a summary of work to date in the field of printed electronics and the materials chemistry involved. In particular, the focus is upon the use of metal- and metal oxide-containing inks in the preparation of contacts and interconnects. The review discusses the challenges associated with processing these types of inks and ways to successfully obtain the desired features.

Graphical abstract: Printed electronics: the challenges involved in printing devices, interconnects, and contacts based on inorganic materials

Back to tab navigation
Please wait while Download options loads

Publication details

The article was received on 02 Feb 2010, accepted on 03 Jun 2010, published on 25 Jun 2010 and first published online on 25 Jun 2010


Article type: Application
DOI: 10.1039/C0JM00264J
Citation: J. Mater. Chem., 2010,20, 8446-8453
  •   Request permissions

    Printed electronics: the challenges involved in printing devices, interconnects, and contacts based on inorganic materials

    J. Perelaer, P. J. Smith, D. Mager, D. Soltman, S. K. Volkman, V. Subramanian, J. G. Korvink and U. S. Schubert, J. Mater. Chem., 2010, 20, 8446
    DOI: 10.1039/C0JM00264J

Search articles by author