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Composition, structure, bonding and thermoelectric properties of “CuT2P3” and “CuT4P3”, members of the T1−x(CuP3)x series with T being Si and Ge

Corresponding authors
Department of Chemistry, McMaster University, 1280 Main Street West, Hamilton, Canada
National Institute for Materials Science, 1-1 Namiki, Tsukuba, Japan
Ames Laboratory, Iowa State University, Ames, USA
Canadian Neutron Beam Centre, NRC, Chalk River, Canada
Dalton Trans., 2010,39, 1105-1112

DOI: 10.1039/B914555A
Received 20 Jul 2009, Accepted 15 Sep 2009
First published online 15 Oct 2009

This article is part of themed collection: Thermoelectric materials
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