Self-assembled CNT circuits with ohmic contacts using Pd hexadecanethiolate as in situ solder

Thiruvelu Bhuvana; Kyle C. Smith; Timothy S. Fisher; Giridhar U. Kulkarni

doi:10.1039/B9NR00035F

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Nanoscale

Issue 2, 2009

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Self-assembled CNT circuits with ohmic contacts using Pd hexadecanethiolate as in situ solder

Thiruvelu Bhuvana , Kyle C. Smith , Timothy S. Fisher and Giridhar U. Kulkarni

Nanoscale, 2009, 1, 271-275

DOI: 10.1039/B9NR00035F
Received 23 Apr 2009, Accepted 14 Aug 2009
First published on the web 16 Sep 2009

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Abstract
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An easy and elegant method of CNT nanocircuit fabrication using a metal organic precursor of Pd, namely, Pd hexadecanethiolate, is presented. This precursor directs the self-assembly of individual CNTs spanning a gap between Au electrodes. This is achieved by first patterning the precursor along the edges of the gap electrodes, as it enables direct patterning by e beam. Further, thermal activation of the precursor at 250 °C leads to metallization and the ohmic electrical contact between the CNTs and the electrodes beneath. A resistive fuse action of the soldered CNTs is observed as well.

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Details of the thermolysis of Pd hexadecanethiolate andpreliminary results on carbon fibre as active element between thegap electrodes
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Self-assembled CNT circuits with ohmic contacts using Pd hexadecanethiolate as in situ solder

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