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Issue 26, 2009
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Electrochemical reactions at a porphyrin–copper interface

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Abstract

The structure and reactivity of a Cu(100) single crystal electrode surface covered with free base meso-tetra (N-methyl-4-pyridinium) porphyrin (abbreviated as H2TMPyP) as a function of electrode potential have been investigated with cyclic voltammetry (CV), electrochemical scanning tunneling microscopy (ECSTM), and UV-Vis and Raman spectroscopy. The well-ordered self-assembled layer of the porphyrin is consistent with the adsorption of the reduced porphyrin species after the first two-electron reduction step. The copper dissolution reaction in the presence of the stable self-assembled porphyrin layer starts at step edges on both upper and lower terraces and coincides with the preferential oxidation of reduced porphyrin species at step sites. The dissolved copper cations are incorporated into the free base porphyrin molecules leading to the formation of CuTMPyP. As a consequence this new species accumulates in the solution with time and a copper redeposition in the cathodic potential scan is lacking.

Graphical abstract: Electrochemical reactions at a porphyrin–copper interface

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Publication details

The article was received on 25 Apr 2008, accepted on 24 Mar 2009 and first published on 23 Apr 2009


Article type: Paper
DOI: 10.1039/B807075J
Citation: Phys. Chem. Chem. Phys., 2009,11, 5422-5430
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    Electrochemical reactions at a porphyrin–copper interface

    N. T. M. Hai, S. Furukawa, T. Vosch, S. De Feyter, P. Broekmann and K. Wandelt, Phys. Chem. Chem. Phys., 2009, 11, 5422
    DOI: 10.1039/B807075J

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