Preparation of glue joints and bridges between Ag nanowires and their metallization. A possible method for nano-soldering

Bridges between Ag nanowires and glue joints were made for the first time in water. TEM observations, SAED, EDS and IR measurements and thermal analyses were conducted. A small amount of dodecanethiol (DT) did not protect the surface of the Ag nanowires from corrosion by Au ions when chloroauric acid was added. However, when an excessive amount of DT was added, the surface was covered with something that was cloud-like and bridges were formed. The mixture of the surplus dodecanethiol (DT) and chloroauric acid may have formed a complex and acted as a glue or a solder on the silver nanowires. In an effort to reinforce the glue joints formed, thermal and chemical reduction methods were compared. The thermal method appears to be superior to the chemical method. The method developed might provide a new means to join two metal nanowires.