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Issue 6, 2008
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Bottom-up assembly of high density molecular nanowire cross junctions at a solid/liquid interface

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Abstract

A monoalkylated tetrathiafulvalene derivative forms multilayer structures at the solid–liquid interface, with high density of cross junctions, which are interesting for molecular electronic circuit self-assembly.

Graphical abstract: Bottom-up assembly of high density molecular nanowire cross junctions at a solid/liquid interface

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Publication details

The article was received on 26 Oct 2007, accepted on 23 Nov 2007 and first published on 11 Dec 2007


Article type: Communication
DOI: 10.1039/B716533A
Citation: Chem. Commun., 2008, 703-705
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    Bottom-up assembly of high density molecular nanowire cross junctions at a solid/liquid interface

    S. Lei, J. Puigmartí-Luis, A. Minoia, M. Van der Auweraer, C. Rovira, R. Lazzaroni, D. B. Amabilino and S. De Feyter, Chem. Commun., 2008, 703
    DOI: 10.1039/B716533A

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