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Issue 34, 2007
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Materials for step and flash imprint lithography (S-FIL®)

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Abstract

Step and flash imprint lithography, or S-FIL®, was introduced in 1999 by The University of Texas at Austin (Proc. SPIE-Int. Soc. Opt. Eng., 1999, 3676, 379), and has progressed from an academic curiosity to commercialization in less than five years (J. Microlithogr., Microfabr., Microsyst., 2005, 4, 1). It has proven to be a cost effective, high resolution alternative to traditional optical lithography and has been placed on The International Technology Roadmap for Semiconductors (ITRS) as a potential candidate for 32 nm device fabrication (http://www.itrs.net/Links/2006Update/FinalToPost/08_Lithography2006Update.pdf.). This article summarizes the efforts made towards the development of imprint materials for S-FIL and the obstacles that have yet to be overcome.

Graphical abstract: Materials for step and flash imprint lithography (S-FIL®)

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Publication details

The article was received on 10 Apr 2007, accepted on 31 May 2007 and first published on 15 Jun 2007


Article type: Application
DOI: 10.1039/B705388F
Citation: J. Mater. Chem., 2007,17, 3575-3580
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    Materials for step and flash imprint lithography (S-FIL®)

    B. K. Long, B. K. Keitz and C. G. Willson, J. Mater. Chem., 2007, 17, 3575
    DOI: 10.1039/B705388F

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