Jump to main content
Jump to site search

Issue 12, 2005
Previous Article Next Article

Construction of microfluidic chips using polydimethylsiloxane for adhesive bonding

Author affiliations

Abstract

A thin layer of polydimethylsiloxane (PDMS) prepolymer, which is coated on a glass slide, is transferred onto the embossed area surfaces of a patterned substrate. This coated substrate is brought into contact with a flat plate, and the two structures are permanently bonded to form a sealed fluidic system by thermocuring (60 °C for 30 min) the prepolymer. The PDMS exists only at the contact area of the two surfaces with a negligible portion exposed to the microfluidic channel. This method is demonstrated by bonding microfluidic channels of two representative soft materials (PDMS substrate on a PDMS plate), and two representative hard materials (glass substrate on a glass plate). The effects of the adhesive layer on the electroosmotic flow (EOF) in glass channels are calculated and compared with the experimental results of a CE separation. For a channel with a size of approximately 10 to 500 µm, a ∼200–500 nm thick adhesive layer creates a bond without voids or excess material and has little effect on the EOF rate. The major advantages of this bonding method are its generality and its ease of use.

Graphical abstract: Construction of microfluidic chips using polydimethylsiloxane for adhesive bonding

Back to tab navigation

Supplementary files

Publication details

The article was received on 22 Jul 2005, accepted on 07 Oct 2005 and first published on 17 Oct 2005


Article type: Paper
DOI: 10.1039/B510494G
Citation: Lab Chip, 2005,5, 1393-1398
  •   Request permissions

    Construction of microfluidic chips using polydimethylsiloxane for adhesive bonding

    H. Wu, B. Huang and R. N. Zare, Lab Chip, 2005, 5, 1393
    DOI: 10.1039/B510494G

Search articles by author

Spotlight

Advertisements