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Self-assembly of copper(II) complexes with ladder, bi-rack, rack–ladder–rack and layer structures by the directional-bonding approach using a T-shaped ligand

Ming-Sheng Wang,a   Guo-Cong Guo,*a   Ming-Lai Fu,a   Ling Xu,a   Li-Zhen Caia and   Jin-Shun Huanga  
Corresponding authors
State Key Laboratory of Structural Chemistry, Fujian Institute of Research on the Structure of Matter, Chinese Academy of Sciences, Fuzhou, P. R. China
Dalton Trans., 2005, 2899-2907

DOI: 10.1039/B501782C
Received 03 Feb 2005, Accepted 07 Jul 2005
First published online 26 Jul 2005
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